Photocouplers with Reinforced Insulation in the New SO6 Package: TLP109,TLP116A

The TLP109 and TLP116A are new additions to Toshiba's photocoupler family in small surface-mount packages. The new photocouplers are housed in the SO6 package, which is pin-compatible with the conventional MFSOP6 package. However, the maximum PCB mounted height has been reduced from 2.8 mm to 2.3 mm, making them ideal for low-profile applications. Additionally, for reinforced insulation, the TLP109 and TLP116A offer clearance and creepage distances of 5 mm or more and an internal Faraday shield with a thickness of 0.4 mm or more. SO6 meets the customer needs for both a thin package and a high level of safety standard compliance, bringing added value to your system.
Features
Packaging Features
Isolation voltage = 3750Vrms
Clearance and creepage distances = 5mm(min)
Internal Faraday shield = 0.4mm thick (min)
Product Offerings
TLP109：General-purpose open-collector outputData transfer rate = 1Mbps(typ.)VCC = 30V(max)
TLP116A：High-speed totem-pole outputData transfer rate = 20Mbps(typ.)VCC = 4.5 to 5.5V