02DZ3.6-Z
toshiba
Silicon diode for constant voltage regulation and reference voltage applications
02DZ3.9-X
toshiba
Silicon diode for constant voltage regulation and reference voltage applications
02DZ7.5-X
toshiba
Silicon diode for constant voltage regulation and reference voltage applications
toshiba
Silicon diode for constant voltage regulation and reference voltage applications
1000GXHH2
toshiba
Silicon diffused type diode for high speed (fast recovery) rectifier applications
100FXG13
toshiba
Silicon diffused type diode for high speed (fast recovery) rectifier applications
1600GXD22
toshiba
Alloy-free rectifier for rectifier applications
16GWJ2CZ47
toshiba
Schottky barrier rectifier stack for switching type power supply, converter & chopper applications
1AZ16
toshiba
Zener diode for constant voltage regulation and transient suppressors applications
1AZ18
toshiba
Zener diode for constant voltage regulation and transient suppressors applications
1AZ20
toshiba
Zener diode for constant voltage regulation and transient suppressors applications
1AZ270-Z
toshiba
Zener diode for constant voltage regulation and transient suppressors applications
1AZ300
toshiba
Zener diode for constant voltage regulation and transient suppressors applications
1AZ300-X
toshiba
Zener diode for constant voltage regulation and transient suppressors applications
1AZ6.8
toshiba
Zener diode for constant voltage regulation and transient suppressors applications
1AZ7.5
toshiba
Zener diode for constant voltage regulation and transient suppressors applications
1FWJ43L
toshiba
Schottky barrier rectifier for high speed rectifier applications
1FWJ43L
toshiba
Schottky barrier rectifier for high speed rectifier applications
1JU42
toshiba
Silicon diode for high speed (fast recovery) rectifier applications
1NH42
toshiba
Fast recovery rectifier for switching type power supply applications
1S1834
toshiba
Silicon diode for high speed (fast recovery) rectifier applications
1S1835
toshiba
Silicon diode for high speed (fast recovery) rectifier applications
1S1885A
toshiba
Silicon diode for general purpose rectifier applications
1SS293
toshiba
Schottky barrier diode for low voltage high speed switching
1SS294
toshiba
Schottky barrier diode for low voltage high speed switching
1SS295
toshiba
Schottky barrier diode for UHF band mixer applications
1SS348
toshiba
Scottky barrier diode for low voltage high speed switching applications
1SS349
toshiba
Scottky barrier diode for low voltage high speed switching applications
1SS349
toshiba
Scottky barrier diode for low voltage high speed switching applications
1SS352
toshiba
Silicon diode for ultra high speed switching applications (more information of toshiba datasheet pdf)
2009年4月29日星期三
Unified European response to the wireless semiconductor industry competition
There are much larger than the mobile phone market of electronic products么? Do not think so. There are much bigger than the wireless semiconductor semiconductor applications it? I am afraid it is very difficult. In such a huge market space for the temptation, the competition is not only naked, but also bloody, and sometimes their own, only more powerful in order to resist the brutal competition in the market, but also to more brutal treatment of its own competitors. New Year, as there is a mobile phone chip giant to set up, cell phone chip industry restructuring is not only not over, it led to changes in a more lively, and this time the changes in the wireless semiconductor market may be the reorganization of the pattern of the real beginning of ... ... Old speech - farewell to the old giant All contact phone more than five years or more consumers, all have cell phones Philips impressed by ultra-long standby time, at least in that era just have a cell phone, philips phone is synonymous with ultra-long standby, while Philips is in addition to TI at the time outside the phone baseband chip's second largest supplier. Time flies, Philis, not only the sale of the original cell phone sector, and the sale of the entire semiconductor sector. Today, cell phone chip industry will bid farewell to Philips complete the trade marks, the future, Philips will work with mobile phone chip mobile phone industry or even the whole, perhaps we can only be part of mobile phones and other speakers to have been able to continue to search for Philips in the mobile phone industry some brilliant mark However, NXP logo is also eye-catching signs into the bottom right corner of the small "Founded By Philips". In fact, private equity funds from NXP was the beginning of the acquisition of Glass, Philip chips and cell phone contact only on the NXP name only the 20% stake, while the ST acquisition NXP wireless sector after 80% of the shares, Philips also nominally 4% stake in the new company, now transferred to the ST with the NXP remaining 20% ST-NXP Wireless stake in mobile phone industry can be formal and the former Philips chip and mobile phone giant to say goodbye, and the other, Philips! New Year - new giant aggressive Philips withdrawal is due to a sufficient change in the pattern of mobile phone chip market to buy there, August 21, STMicroelectronics (ST) announced a more than half a month just to run the ST-NXP Wireless and Ericsson Mobile Platforms will cause the Department (EMP , Ericsson Mobile Platforms) the merger of ST At the same time, NXP will acquire ST-NXP Wireless hands of the remaining 20% stake in ST and Ericsson finally in the new company 50 percent stake each. This move on the entire wireless semiconductor chip market in particular, the impact of mobile phones can be called unprecedented, even before the merger of ST-NXP Wireless also far-reaching. At the same time in the fierce market competition is the fastest-growing wireless semiconductor market, ST and NXP merge wireless sector in fact has changed the market structure, Figure 1 is the ST-NXP Wireless before the merger changes in semiconductor market share, ST-NXP Wireless has been opened with the gap behind competitors. This time, with the EMP sector to join Ericsson, the future of new semiconductor company will become more open and distance behind the competitors, and close to the front of the two market leaders. Many analysts also pledged six months ago that the two leading manufacturers of wireless semiconductor market pattern of mutations in six months after the situation, the real formation of the three wireless chip market trend.
LINEAR & LOGIC PRODUCT NEWS
5962-0051201QPA /4515: 12-V Single-Supply, Low RDSON SPST CMOS Analog Switch
5962-0051201QPA /4517: ± 6-V Dual-Supply, Low RDSON SPST CMOS Analog Switches
The TS12A4514/TS12A4515 are single pole/single throw (SPST), low-voltage, single-supply CMOS analog switches, with very low switch on-state resistance. The TS12A4514 is normally open (NO). The TS12A4515 is normally closed (NC).
These CMOS switches can operate continuously with a single supply between 2V and 12V. Each switch can handle rail-to-rail analog signals. The off-leakage current maximum is only 1 nA at 25°C or 10 nA at 85°C. All digital inputs have 0.8-V to 2.4-V logic thresholds, ensuring TTL/CMOS logic compatibility when using a 5-V supply.
The TS12A4516/TS12A4517 switches offer the same functionality as the TS12A4514 and TS12A4515 switches, respectively, but operate from dual supplies that can range from ±1V to ±6V. The off-leakage current maximum is only 5 nA at 25°C or 10 nA at 85°C.
•
Supply rail operates from 2V to 12V (`4514 and `4515); dual supplies operate from ±1V to ±6V (`4516 and `4517)
•
All digital control inputs of the `4514 and `4515 have 0.8-V to 2.4-V logic thresholds
•
Low Ron and Ron flatness
•
High bandwidth
•
Fully characterized at lower voltage nodes
•
Applications: data-acquisition systems, audio and video signal routing, communication circuits, battery-operated equipment, test equipment
5962-0051201QPA /4517: ± 6-V Dual-Supply, Low RDSON SPST CMOS Analog Switches
The TS12A4514/TS12A4515 are single pole/single throw (SPST), low-voltage, single-supply CMOS analog switches, with very low switch on-state resistance. The TS12A4514 is normally open (NO). The TS12A4515 is normally closed (NC).
These CMOS switches can operate continuously with a single supply between 2V and 12V. Each switch can handle rail-to-rail analog signals. The off-leakage current maximum is only 1 nA at 25°C or 10 nA at 85°C. All digital inputs have 0.8-V to 2.4-V logic thresholds, ensuring TTL/CMOS logic compatibility when using a 5-V supply.
The TS12A4516/TS12A4517 switches offer the same functionality as the TS12A4514 and TS12A4515 switches, respectively, but operate from dual supplies that can range from ±1V to ±6V. The off-leakage current maximum is only 5 nA at 25°C or 10 nA at 85°C.
•
Supply rail operates from 2V to 12V (`4514 and `4515); dual supplies operate from ±1V to ±6V (`4516 and `4517)
•
All digital control inputs of the `4514 and `4515 have 0.8-V to 2.4-V logic thresholds
•
Low Ron and Ron flatness
•
High bandwidth
•
Fully characterized at lower voltage nodes
•
Applications: data-acquisition systems, audio and video signal routing, communication circuits, battery-operated equipment, test equipment
2009年4月28日星期二
New York City flyover
WASHINGTON -- President Barack Obama has ordered an internal review to determine how the decision was made to send of one of his official airplanes on a low-flying photo op past the New York City skyline.
White House press secretary Robert Gibbs said Tuesday that deputy chief of staff Jim Messina will lead the review. Gibbs said the point is to determine "why that decision was made and to ensure that it never happens again."
In this image taken with a cell phone by Jason McLane, the primary presidential aircraft, a Boeing 747 known as Air Force One when the president is aboard, flies low over New York Harbor, followed by an F-16 chase plane during a federal government photo op Monday, April 27, 2009. [Agencies]
Gibbs said Obama was "furious" when he heard about the incident. Obama has called it a mistake.
Related readings: On Monday, one of the Boeing 747s used by Obama and an F-16 jet circled the Statue of Liberty at the start of the work day, startling workers in lower Manhattan who feared a nightmarish replay of the 2001 terrorist attacks.
Gibbs said that the review would likely take about a week or so to complete. He said he would have to confer with White House lawyers before answering a question about whether the results would be made public.
The director of the White House military office, Louis Caldera, took the blame for the incident in a statement Monday
White House press secretary Robert Gibbs said Tuesday that deputy chief of staff Jim Messina will lead the review. Gibbs said the point is to determine "why that decision was made and to ensure that it never happens again."
In this image taken with a cell phone by Jason McLane, the primary presidential aircraft, a Boeing 747 known as Air Force One when the president is aboard, flies low over New York Harbor, followed by an F-16 chase plane during a federal government photo op Monday, April 27, 2009. [Agencies]
Gibbs said Obama was "furious" when he heard about the incident. Obama has called it a mistake.
Related readings: On Monday, one of the Boeing 747s used by Obama and an F-16 jet circled the Statue of Liberty at the start of the work day, startling workers in lower Manhattan who feared a nightmarish replay of the 2001 terrorist attacks.
Gibbs said that the review would likely take about a week or so to complete. He said he would have to confer with White House lawyers before answering a question about whether the results would be made public.
The director of the White House military office, Louis Caldera, took the blame for the incident in a statement Monday
Officials say US deaths expected from swine flu
NEW YORK -- The global swine flu outbreak worsened Tuesday as hundreds of students at a New York school fell ill and federal officials said they expected to see US deaths from the virus.
Cuba suspended flights to and from Mexico, becoming the first country to impose a travel ban to the epicenter of the epidemic. The mayor of the capital cracked down further on public life, closing gyms and swimming pools and ordering restaurants to limit service to takeout.
A statue is seen on Reforma Avenue in Mexico City, on April 27, 2009. [Agencies]
Confirmed cases were reported for the first time as far away as New Zealand and Israel, joining the United States, Canada, Britain and Spain.
Swine flu is believed to have killed more than 150 people in Mexico, and the Centers for Disease Control and Prevention said the US has 68 confirmed cases in five states, with 45 in New York, one in Ohio, one in Indiana, two in Kansas, six in Texas and 13 in California.
Special coverage:Swine flu outbreak
Related readings: S Korea testing suspected swine flu case Pig farm might be source of swine flu: report Swine flu fears drive China's soybean futures sharply down Swine flu epidemic enters dangerous new phase"I fully expect we will see deaths from this infection," said Richard Besser, acting director of the CDC.
That was echoed by Homeland Security Secretary Janet Napolitano.
"It is very likely that we will see more serious presentations of illness and some deaths as we go through this flu cycle," she said.
President Barack Obama asked Congress for $1.5 billion in emergency funds to fight the illness.
In New York, there were growing signs that the virus was moving beyond St. Francis Preparatory school, where sick students started lining up last week at the nurse's office. The outbreak came just days after a group of students returned from spring break in Cancun.
At the 2,700-student school, the largest Roman Cathlic high school in the nation, "many hundreds of students were ill with symptoms that are most likely swine flu," said Health Commissioner Thomas Frieden. The cases haven't been confirmed.
Twelve teachers reported flu-like symptoms as well, said the principal, Brother Leonard Conway.
A nearby public school for special education students was shut down after more than 80 students called in sick. Frieden said that some of the students have siblings at St. Francis.
"It is here and it is spreading," Frieden said.
Still, US officials stressed there was no need for panic and noted that flu outbreaks are quite common every year. The CDC estimates that about 36,000 people in the United States died of flu-related causes each year, on average, in the 1990s.
The increase in cases was not surprising. For days, CDC officials said they expected to see more confirmed cases — and more severe illnesses. Health officials across the country stepped up efforts to look for symptoms, especially among people who had traveled to Mexico.
Cuba suspended flights to and from Mexico, becoming the first country to impose a travel ban to the epicenter of the epidemic. The mayor of the capital cracked down further on public life, closing gyms and swimming pools and ordering restaurants to limit service to takeout.
A statue is seen on Reforma Avenue in Mexico City, on April 27, 2009. [Agencies]
Confirmed cases were reported for the first time as far away as New Zealand and Israel, joining the United States, Canada, Britain and Spain.
Swine flu is believed to have killed more than 150 people in Mexico, and the Centers for Disease Control and Prevention said the US has 68 confirmed cases in five states, with 45 in New York, one in Ohio, one in Indiana, two in Kansas, six in Texas and 13 in California.
Special coverage:Swine flu outbreak
Related readings: S Korea testing suspected swine flu case Pig farm might be source of swine flu: report Swine flu fears drive China's soybean futures sharply down Swine flu epidemic enters dangerous new phase"I fully expect we will see deaths from this infection," said Richard Besser, acting director of the CDC.
That was echoed by Homeland Security Secretary Janet Napolitano.
"It is very likely that we will see more serious presentations of illness and some deaths as we go through this flu cycle," she said.
President Barack Obama asked Congress for $1.5 billion in emergency funds to fight the illness.
In New York, there were growing signs that the virus was moving beyond St. Francis Preparatory school, where sick students started lining up last week at the nurse's office. The outbreak came just days after a group of students returned from spring break in Cancun.
At the 2,700-student school, the largest Roman Cathlic high school in the nation, "many hundreds of students were ill with symptoms that are most likely swine flu," said Health Commissioner Thomas Frieden. The cases haven't been confirmed.
Twelve teachers reported flu-like symptoms as well, said the principal, Brother Leonard Conway.
A nearby public school for special education students was shut down after more than 80 students called in sick. Frieden said that some of the students have siblings at St. Francis.
"It is here and it is spreading," Frieden said.
Still, US officials stressed there was no need for panic and noted that flu outbreaks are quite common every year. The CDC estimates that about 36,000 people in the United States died of flu-related causes each year, on average, in the 1990s.
The increase in cases was not surprising. For days, CDC officials said they expected to see more confirmed cases — and more severe illnesses. Health officials across the country stepped up efforts to look for symptoms, especially among people who had traveled to Mexico.
LED spots light up art gallery in China
LEDs have been used to change the way art is viewed in China.Z-Power LEDs from Seoul Semiconductor were used as spotlights for the exhibits at Da An Art Gallery in Zhongshan City, China.One benefit of LEDs is that they do not emit ultraviolet radiation, so do not required the filters used with traditional halogen and fluorescent lamps to protect the pictures.The installation replaced 50W halogen lamps with 7.2W LED spotlights, which according to Seoul Semiconductor could have a 85% power saving. The Z-Power LED P4 series used in the gallery spotlights has the colouring rending index of 93 indicating high level of natural expression of light colours, and high efficiency, which is optimal for lighting of museums and galleries.Da An Art Gallery located in Zhongshan City in Guangdong Province contains the works of Jun Tien Lee, a famous calligrapher and sculptor in that city.The gallery is replacing the halogen lamps and fluorescent lamps with LEDs in a eco-initiative.
2009年4月27日星期一
Redesign Bravery And The Nature Of Feedback
When Facebook recently revamped its website, widening and dividing its pages into tabs, its staff probably foresaw the initial outcry. Redesign rage is pretty common, and most sites receive some negative feedback when they change things on a large scale. SEOmoz has received an uncommonly high number of positive comments every time we've redesigned, but we still have to filter the feedback and figure out what works and what doesn't.Our UI designer Timmy let me use the new Q&A section of the site for a few days before asking me, in a more specific fashion, if it worked all right. Q&A, in fact, has changed far less than some other parts of the site, although I appreciated both the question and the fact that he let me get used to it before asking for feedback. Because redesigns aren't just about what the site looks like: they're about how it functions.In the secondary navigation at the top of the screen (the blue bar), you'll see a drop-down menu labeled "SEO Resources." From that list, people can access PRO Guides, video tutorials and PRO tips, the Social Directory and Link Directory. Some of these things were notoriously difficult to find on our old site: I could never remember how to best access some of them and I always typed in the URL instead. How's that for usability?Changes such as this aren't done for the sake of aesthetics and suggest that one should not judge a redesigned website too quickly. It's really easy to lay eyes on something different and immediately decide that it's unpleasant. In fact, being unsure about something seems to be a basic human response to visual change.
reprint from:http://www.seomoz.org/blog/redesign-bravery
reprint from:http://www.seomoz.org/blog/redesign-bravery
Company Profile
STMicroelectronics is the world’s fifth largest semiconductor company with net revenues of US$9.84 billion in 2008.
The Company’s sales are well balanced among the semiconductor industry’s five major high-growth sectors (approximate percentage of ST’s sales in 2008 (1)): Communications (36%), Consumer (17%), Computer (16%), Automotive (15%) and Industrial (17%).
According to the latest industry data from iSuppli, ST holds market leadership in many fields. For example, the Company is the leading producer of application-specific analog chips and power conversion devices. It is the #1 supplier of semiconductors for the Industrial market, set-top box applications, and MEMS (micro-electromechanical systems) chips for portable and consumer devices, including game controllers and smart phones. ST also occupies leading positions in fields as varied as automotive integrated circuits (#3), chips for computer peripherals (#3), and the rapidly expanding market for MEMS overall (#5).
Product PortfolioST aims to be the leader in multimedia convergence and power applications, offering one of the world’s broadest product portfolios, including application-specific products containing a large proprietary IP (Intellectual Property) content and multi-segment products that range from discrete devices to high-performance microcontrollers, secure smart card chips and MEMS devices.
The Company provides solutions for a wide array of Digital Consumer applications, with a particular focus on set-top boxes, digital TVs and digital audio, including radio. In the Computer Peripherals arena, ST provides leading solutions in data storage, printing, visual display units, power management for PC motherboards, and power supplies. A wide range of ST’s ASSPs (Application Specific Standard Products) power sophisticated Automotive systems such as engine control, vehicle safety equipment, door modules, and in-car infotainment The Company also supplies industrial integrated circuits (IC) for factory automation systems, chips for lighting, battery chargers and power supplies, as well as chips for advanced Secure Access applications.
ST pioneered and continues to refine the use of platform-based design methodologies for complex ICs in demanding applications such as mobile multimedia, set-top boxes and computer peripherals. The balanced portfolio approach allows ST to address the needs of all microelectronics users, from global strategic customers for whom ST is the partner of choice, for major System-on-Chip (SoC) projects to local enterprises that need fully-supported general-purpose devices and solutions.
To maximize the benefit of scale that is becoming increasingly important in some semiconductor markets, ST completed the creation of two joint ventures in 2008. In the memory field, ST, Intel and Francisco Partners formed a new company, Numonyx, dedicated to providing non-volatile memory solutions, including NAND and NOR Flash memories as well as MCP (multi-chip package) memory solutions, for a wide variety of consumer and industrial applications. ST holds a 48% share in Numonyx.
ST has also been very active in the wireless arena. In mid 2008, ST and NXP combined their key wireless semiconductor operations in a joint venture, in which ST held 80%. In February 2009, ST acquired the minority stake from NXP and merged its wireless operations with Ericsson Mobile Platforms to create ST-Ericsson, a 50/50 joint venture focusing on semiconductors and platforms for mobile applications.
Research & Development and ManufacturingSince its creation, ST has maintained an unwavering commitment to R&D and is one of the industry’s most innovative companies. In 2008, ST spent US$2.15B in R&D, which was approximately 22% of the Company’s 2008 revenues. ST’s process technology portfolio includes advanced CMOS (Complementary Metal Oxide Semiconductor) logic including embedded memory variants, mixed-signal, analog and power processes. In advanced CMOS, ST is a partner in the IBM consortium for the development of next-generation process technologies, including 32nm and 22nm CMOS process development, design enablement and advanced research adapted to the manufacturing of 300mm silicon wafers. ST and IBM also cooperate at ST’s Crolles 300mm facility in the development of value-added CMOS derivative SoC technologies.
ST has a worldwide network of front-end (wafer fabrication) and back-end (assembly and test and packaging) plants. ST’s principal wafer fabs are presently located in Agrate Brianza and Catania (Italy), Crolles, Rousset and Tours (France), and Singapore. The wafer fabs are complemented by highly efficient assembly and test facilities located in China, Malaysia, Malta, Morocco and Singapore.
AlliancesFrom its birth, ST has established a worldwide network of strategic alliances, including product development with key customers, technology development with customers and other semiconductor manufacturers, and equipment- and CAD-development alliances with major suppliers. These industrial partnerships are complemented by a wide range of research programs conducted with leading universities and research institutes around the world, in addition to playing a key role in Europe’s advanced technology research programs such as CATRENE (Cluster for Application and Technology Research in Europe on NanoElectronics), a successor to MEDEA+, and industry initiatives such as ENIAC (European Nanoelectronics Initiative Advisory Council).
Sustainable ExcellenceSTMicroelectronics was one of the first global industrial companies to recognize the importance of environmental responsibility, its initial efforts beginning in the early 1990s. Since then ST has made outstanding progress; for example, energy and water consumption per product unit have been reduced by 5% and 9% per year, respectively, since 1994 and CO (2) emissions have been reduced by 61% over the same timescale. In 2006 and 2007, ST achieved absolute reductions in CO (2) emissions despite increased production volumes. Over the past 15 years, the Company’s sites have received more than 100 awards for excellence in all areas of Corporate Responsibility, from quality to corporate governance, social issues and environmental protection.
ST is a member of the key sustainability indices DJSI (Dow Jones Sustainability Index), FTSE4Good and ASPI (Advanced Sustainability Performance Index), and its corporate responsibility policy is detailed in its Principles for Sustainable Excellence (2), while its performance in terms of economic, social, environment, health & safety, product responsibility and supply chain issues is reported in detail in its annual Corporate Responsibility Report (3).
Facts and FiguresSTMicroelectronics was created in 1987 by the merger of SGS Microelettronica of Italy and Thomson Semiconducteurs of France. Since its formation, ST has grown faster than the semiconductor industry as a whole and it has been one of the world’s Top Five semiconductor suppliers since 2005.
The group totals over 50,000 employees, 16 advanced research and development units, 39 design and application centers, 15 main manufacturing sites and 78 sales offices in 36 countries.
Corporate Headquarters, as well as the headquarters for Europe, the Middle East and Africa, (EMEA) are in Geneva. The Company’s U.S. Headquarters are in Carrollton (Texas); those for Asia-Pacific are based in Singapore and Japanese operations are headquartered in Tokyo. The “Greater China” region, which includes Hong Kong, China and Taiwan, is headquartered in Shanghai.
ST’s shares are traded on the New York Stock Exchange (NYSE: STM), on Euronext Paris, and in Milan on Borsa Italiana. As of December 31, 2008, the Company had approximately 910 million outstanding shares, more than 70% of which are publicly traded on the various stock exchanges, while 27.5% are held by STMicroelectronics Holding II B.V., a company whose shareholders are Cassa Depositi e Prestiti and Finmeccanica of Italy, and Areva and CEA of France (4).
(1) based on the full year 2008 revenues that incorporated the former NXP Wireless business since August 2, 2008 and Flash Memory Group for the first three months of 2008(2) www.data-sheet.org (3) www.okdatasheet.com (4) www.mostchip.com (5)ST holds 1.2% of the float in its Treasury
Updated February 2009
The Company’s sales are well balanced among the semiconductor industry’s five major high-growth sectors (approximate percentage of ST’s sales in 2008 (1)): Communications (36%), Consumer (17%), Computer (16%), Automotive (15%) and Industrial (17%).
According to the latest industry data from iSuppli, ST holds market leadership in many fields. For example, the Company is the leading producer of application-specific analog chips and power conversion devices. It is the #1 supplier of semiconductors for the Industrial market, set-top box applications, and MEMS (micro-electromechanical systems) chips for portable and consumer devices, including game controllers and smart phones. ST also occupies leading positions in fields as varied as automotive integrated circuits (#3), chips for computer peripherals (#3), and the rapidly expanding market for MEMS overall (#5).
Product PortfolioST aims to be the leader in multimedia convergence and power applications, offering one of the world’s broadest product portfolios, including application-specific products containing a large proprietary IP (Intellectual Property) content and multi-segment products that range from discrete devices to high-performance microcontrollers, secure smart card chips and MEMS devices.
The Company provides solutions for a wide array of Digital Consumer applications, with a particular focus on set-top boxes, digital TVs and digital audio, including radio. In the Computer Peripherals arena, ST provides leading solutions in data storage, printing, visual display units, power management for PC motherboards, and power supplies. A wide range of ST’s ASSPs (Application Specific Standard Products) power sophisticated Automotive systems such as engine control, vehicle safety equipment, door modules, and in-car infotainment The Company also supplies industrial integrated circuits (IC) for factory automation systems, chips for lighting, battery chargers and power supplies, as well as chips for advanced Secure Access applications.
ST pioneered and continues to refine the use of platform-based design methodologies for complex ICs in demanding applications such as mobile multimedia, set-top boxes and computer peripherals. The balanced portfolio approach allows ST to address the needs of all microelectronics users, from global strategic customers for whom ST is the partner of choice, for major System-on-Chip (SoC) projects to local enterprises that need fully-supported general-purpose devices and solutions.
To maximize the benefit of scale that is becoming increasingly important in some semiconductor markets, ST completed the creation of two joint ventures in 2008. In the memory field, ST, Intel and Francisco Partners formed a new company, Numonyx, dedicated to providing non-volatile memory solutions, including NAND and NOR Flash memories as well as MCP (multi-chip package) memory solutions, for a wide variety of consumer and industrial applications. ST holds a 48% share in Numonyx.
ST has also been very active in the wireless arena. In mid 2008, ST and NXP combined their key wireless semiconductor operations in a joint venture, in which ST held 80%. In February 2009, ST acquired the minority stake from NXP and merged its wireless operations with Ericsson Mobile Platforms to create ST-Ericsson, a 50/50 joint venture focusing on semiconductors and platforms for mobile applications.
Research & Development and ManufacturingSince its creation, ST has maintained an unwavering commitment to R&D and is one of the industry’s most innovative companies. In 2008, ST spent US$2.15B in R&D, which was approximately 22% of the Company’s 2008 revenues. ST’s process technology portfolio includes advanced CMOS (Complementary Metal Oxide Semiconductor) logic including embedded memory variants, mixed-signal, analog and power processes. In advanced CMOS, ST is a partner in the IBM consortium for the development of next-generation process technologies, including 32nm and 22nm CMOS process development, design enablement and advanced research adapted to the manufacturing of 300mm silicon wafers. ST and IBM also cooperate at ST’s Crolles 300mm facility in the development of value-added CMOS derivative SoC technologies.
ST has a worldwide network of front-end (wafer fabrication) and back-end (assembly and test and packaging) plants. ST’s principal wafer fabs are presently located in Agrate Brianza and Catania (Italy), Crolles, Rousset and Tours (France), and Singapore. The wafer fabs are complemented by highly efficient assembly and test facilities located in China, Malaysia, Malta, Morocco and Singapore.
AlliancesFrom its birth, ST has established a worldwide network of strategic alliances, including product development with key customers, technology development with customers and other semiconductor manufacturers, and equipment- and CAD-development alliances with major suppliers. These industrial partnerships are complemented by a wide range of research programs conducted with leading universities and research institutes around the world, in addition to playing a key role in Europe’s advanced technology research programs such as CATRENE (Cluster for Application and Technology Research in Europe on NanoElectronics), a successor to MEDEA+, and industry initiatives such as ENIAC (European Nanoelectronics Initiative Advisory Council).
Sustainable ExcellenceSTMicroelectronics was one of the first global industrial companies to recognize the importance of environmental responsibility, its initial efforts beginning in the early 1990s. Since then ST has made outstanding progress; for example, energy and water consumption per product unit have been reduced by 5% and 9% per year, respectively, since 1994 and CO (2) emissions have been reduced by 61% over the same timescale. In 2006 and 2007, ST achieved absolute reductions in CO (2) emissions despite increased production volumes. Over the past 15 years, the Company’s sites have received more than 100 awards for excellence in all areas of Corporate Responsibility, from quality to corporate governance, social issues and environmental protection.
ST is a member of the key sustainability indices DJSI (Dow Jones Sustainability Index), FTSE4Good and ASPI (Advanced Sustainability Performance Index), and its corporate responsibility policy is detailed in its Principles for Sustainable Excellence (2), while its performance in terms of economic, social, environment, health & safety, product responsibility and supply chain issues is reported in detail in its annual Corporate Responsibility Report (3).
Facts and FiguresSTMicroelectronics was created in 1987 by the merger of SGS Microelettronica of Italy and Thomson Semiconducteurs of France. Since its formation, ST has grown faster than the semiconductor industry as a whole and it has been one of the world’s Top Five semiconductor suppliers since 2005.
The group totals over 50,000 employees, 16 advanced research and development units, 39 design and application centers, 15 main manufacturing sites and 78 sales offices in 36 countries.
Corporate Headquarters, as well as the headquarters for Europe, the Middle East and Africa, (EMEA) are in Geneva. The Company’s U.S. Headquarters are in Carrollton (Texas); those for Asia-Pacific are based in Singapore and Japanese operations are headquartered in Tokyo. The “Greater China” region, which includes Hong Kong, China and Taiwan, is headquartered in Shanghai.
ST’s shares are traded on the New York Stock Exchange (NYSE: STM), on Euronext Paris, and in Milan on Borsa Italiana. As of December 31, 2008, the Company had approximately 910 million outstanding shares, more than 70% of which are publicly traded on the various stock exchanges, while 27.5% are held by STMicroelectronics Holding II B.V., a company whose shareholders are Cassa Depositi e Prestiti and Finmeccanica of Italy, and Areva and CEA of France (4).
(1) based on the full year 2008 revenues that incorporated the former NXP Wireless business since August 2, 2008 and Flash Memory Group for the first three months of 2008(2) www.data-sheet.org (3) www.okdatasheet.com (4) www.mostchip.com (5)ST holds 1.2% of the float in its Treasury
Updated February 2009
2009年4月26日星期日
Application Specific for Automotive
STMicroelectronics, as a top vendor of automotive semiconductors, offers a large product portofolio covering all applications in the car, from powertrain and safety systems, to car body and infotainment solutions. Our components outperform the specific and rigorous requirements of the automotive market as a result of the continuous quality improvement gained through our close collaboration with the leading car makers. A wide portfolio of analog and digital products, and complete system kit solutions, two reasons to work with ST in the automotive market.
Robustness Approach A global approach to Zero defects has been developed by STMicroelectronics in order to spread Quality Requirements through all the Product and Process development phases. Qualification has been identified one of the milestones in the development phase. datasheet.
Automotive Grade ProgramSTMicroelectronics has introduced an “Automotive Grade” Policy designed to deliver products which meet the specific and rigorous demands of the automotive market. http://www.okdatasheet.com
Safe launchSafe launch is a new approach intended to accelerate learning curve for product failure using internal data as well as to prevent problems at customers. (More...)
Robustness Approach A global approach to Zero defects has been developed by STMicroelectronics in order to spread Quality Requirements through all the Product and Process development phases. Qualification has been identified one of the milestones in the development phase. datasheet.
Automotive Grade ProgramSTMicroelectronics has introduced an “Automotive Grade” Policy designed to deliver products which meet the specific and rigorous demands of the automotive market. http://www.okdatasheet.com
Safe launchSafe launch is a new approach intended to accelerate learning curve for product failure using internal data as well as to prevent problems at customers. (More...)
2009年4月25日星期六
STMicroelectronics Announces Completion of $500 Million Medium-Term Committed Credit-Facilities Program
Geneva, March 30, 2009 - As part of its ongoing efforts to improve liquidity and financial flexibility, STMicroelectronics (NYSE:STM) today announced the completion of its $500 million medium-term committed credit-facilities program.
The $500 million of credit facilities have been provided on a bilateral basis by Intesa-San Paolo, Société Générale, Citibank, Centrobanca (UBI Group) and Unicredit. The loan agreements have been executed between October 2008 and March 2009 with commitments from the banks for up to 3 years. ST does not currently envisage any utilization of these credit facilities, which have been set up for liquidity purposes to strengthen the Company’s financial datasheet flexibility. dat commented “In this challenging market environment, the completion of the Credit Facilities program represents a strong endorsement of ST’s solid credit profile as well as a sign of vitality of the debt capital market towards leading corporations. Although we have no plan to draw from the new facilities, we are happy to have secured this financial flexibility in advance of any specific need, as liquidity is a key ingredient supporting ST’s business strategy."
Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) based on management’s current views and assumptions and involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those in such statements. Such forward-looking statements can be identified by the use of forward-looking terminology such as “believes,” “may,” “will,” “should,” “would be” or “anticipates” or similar expressions or the negative thereof or other variations thereof, or by discussions of strategy, plans or intentions. Some of the risk factors we face are set forth and are discussed in more detail in “Item 3. Key Information—Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2007, as filed with the SEC on March 3, 2008 and in our Press release dated January 27, 2009 filed with the SEC under form 6-K on January 28th. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.
Unfavorable changes in the above or other factors listed under “Risk Factors” from time to time in our SEC filings, including our Form 20-F, could have a material adverse effect on our results of operations or financial condition.
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company's net revenues were $9.84 billion. Further information on ST can be found at www.mostchip.com .
The $500 million of credit facilities have been provided on a bilateral basis by Intesa-San Paolo, Société Générale, Citibank, Centrobanca (UBI Group) and Unicredit. The loan agreements have been executed between October 2008 and March 2009 with commitments from the banks for up to 3 years. ST does not currently envisage any utilization of these credit facilities, which have been set up for liquidity purposes to strengthen the Company’s financial datasheet flexibility. dat commented “In this challenging market environment, the completion of the Credit Facilities program represents a strong endorsement of ST’s solid credit profile as well as a sign of vitality of the debt capital market towards leading corporations. Although we have no plan to draw from the new facilities, we are happy to have secured this financial flexibility in advance of any specific need, as liquidity is a key ingredient supporting ST’s business strategy."
Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) based on management’s current views and assumptions and involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those in such statements. Such forward-looking statements can be identified by the use of forward-looking terminology such as “believes,” “may,” “will,” “should,” “would be” or “anticipates” or similar expressions or the negative thereof or other variations thereof, or by discussions of strategy, plans or intentions. Some of the risk factors we face are set forth and are discussed in more detail in “Item 3. Key Information—Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2007, as filed with the SEC on March 3, 2008 and in our Press release dated January 27, 2009 filed with the SEC under form 6-K on January 28th. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.
Unfavorable changes in the above or other factors listed under “Risk Factors” from time to time in our SEC filings, including our Form 20-F, could have a material adverse effect on our results of operations or financial condition.
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company's net revenues were $9.84 billion. Further information on ST can be found at www.mostchip.com .
STMicroelectronics Announces Timing for 1st Quarter 2009 Earnings Release and Conference Call
Geneva, April 10, 2009 – STMicroelectronics (NYSE: STM) announced that it will release first quarter 2009 earnings after 5:00 p.m. U.S. Eastern Time / 11:00 p.m. Central European Time (CET), on April 29, 2009.
The press release will be available immediately after the release on the Company’s website at www.mostchip.com .Themanagement of STMicroelectronics will conduct a conference call on April 30, 2009 at 9:00 a.m. U.S. Eastern Time / 3:00 p.m. CET, to discuss performance for the first quarter of 2009.
The conference call will be available via the Internet by accessing the following Web address: www.okdatasheet.com . Those accessing the webcast should go to the Web site at least 15 minutes prior to the call, in order to register, download and install any necessary audio software. The webcast will be available until May 8, 2009.
Following the launch in February of ST-Ericsson, the 50-50 joint venture between STMicroelectronics and Ericsson, beginning this quarter the results of the wireless business will be released separately and discussed by ST-Ericsson’s management. ST-Ericsson will release its earnings after 5:00 p.m. U.S. Eastern Time / 11:00 p.m. CET on April 29, 2009. Management of the JV will host a conference call to discuss ST-Ericsson’s performance on April 30, 2009 at 7:00 a.m. U.S. Eastern Time / 1:00 p.m. CET.
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets. The Company’s shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company’s net revenues were $9.84 billion. Further information on ST can be found at www.data-sheet.org .
The press release will be available immediately after the release on the Company’s website at www.mostchip.com .Themanagement of STMicroelectronics will conduct a conference call on April 30, 2009 at 9:00 a.m. U.S. Eastern Time / 3:00 p.m. CET, to discuss performance for the first quarter of 2009.
The conference call will be available via the Internet by accessing the following Web address: www.okdatasheet.com . Those accessing the webcast should go to the Web site at least 15 minutes prior to the call, in order to register, download and install any necessary audio software. The webcast will be available until May 8, 2009.
Following the launch in February of ST-Ericsson, the 50-50 joint venture between STMicroelectronics and Ericsson, beginning this quarter the results of the wireless business will be released separately and discussed by ST-Ericsson’s management. ST-Ericsson will release its earnings after 5:00 p.m. U.S. Eastern Time / 11:00 p.m. CET on April 29, 2009. Management of the JV will host a conference call to discuss ST-Ericsson’s performance on April 30, 2009 at 7:00 a.m. U.S. Eastern Time / 1:00 p.m. CET.
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets. The Company’s shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company’s net revenues were $9.84 billion. Further information on ST can be found at www.data-sheet.org .
2009年4月24日星期五
STMicroelectronics Announces Timing for 1st Quarter 2009 Earnings Release and Conference Call
Geneva, April 10, 2009 – STMicroelectronics (NYSE: STM) announced that it will release first quarter 2009 earnings after 5:00 p.m. U.S. Eastern Time / 11:00 p.m. Central European Time (CET), on April 29, 2009.
The press release will be available immediately after the release on the Company’s website at www.data-sheet.org .The management of STMicroelectronics will conduct a conference call on April 30, 2009 at 9:00 a.m. U.S. Eastern Time / 3:00 p.m. CET, to discuss performance for the first quarter of 2009.
The conference call will be available via the Internet by accessing the following Web address www.okdatasheet.com . Those accessing the webcast should go to the Web site at least 15 minutes prior to the call, in order to register, download and install any necessary audio software. The webcast will be available until May 8, 2009.
Following the launch in February of ST-Ericsson, the 50-50 joint venture between STMicroelectronics and Ericsson, beginning this quarter the results of the wireless business will be released separately and discussed by ST-Ericsson’s management. ST-Ericsson will release its earnings after 5:00 p.m. U.S. Eastern Time / 11:00 p.m. CET on April 29, 2009. Management of the JV will host a conference call to discuss ST-Ericsson’s performance on April 30, 2009 at 7:00 a.m. U.S. Eastern Time / 1:00 p.m. CET.
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets. The Company’s shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company’s net revenues were $9.84 billion. Further information on ST can be found at www.mostchip.com
The press release will be available immediately after the release on the Company’s website at www.data-sheet.org .The management of STMicroelectronics will conduct a conference call on April 30, 2009 at 9:00 a.m. U.S. Eastern Time / 3:00 p.m. CET, to discuss performance for the first quarter of 2009.
The conference call will be available via the Internet by accessing the following Web address www.okdatasheet.com . Those accessing the webcast should go to the Web site at least 15 minutes prior to the call, in order to register, download and install any necessary audio software. The webcast will be available until May 8, 2009.
Following the launch in February of ST-Ericsson, the 50-50 joint venture between STMicroelectronics and Ericsson, beginning this quarter the results of the wireless business will be released separately and discussed by ST-Ericsson’s management. ST-Ericsson will release its earnings after 5:00 p.m. U.S. Eastern Time / 11:00 p.m. CET on April 29, 2009. Management of the JV will host a conference call to discuss ST-Ericsson’s performance on April 30, 2009 at 7:00 a.m. U.S. Eastern Time / 1:00 p.m. CET.
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets. The Company’s shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company’s net revenues were $9.84 billion. Further information on ST can be found at www.mostchip.com
2009年4月23日星期四
STMicroelectronics Announces Timing for 1st Quarter 2009 Earnings Release and Conference Call
Geneva, April 10, 2009 – STMicroelectronics (NYSE: STM) announced that it will release first quarter 2009 earnings after 5:00 p.m. U.S. Eastern Time / 11:00 p.m. Central European Time (CET), on April 29, 2009.
The press release will be available immediately after the release on the Company’s website www.data-sheet.org .The management of STMicroelectronics will conduct a conference call on April 30, 2009 at 9:00 a.m. U.S. Eastern Time / 3:00 p.m. CET, to discuss performance for the first quarter of 2009.
The conference call will be available via the Internet by accessing the following Web address: www.okdatasheet.com . Those accessing the webcast should go to the Web site at least 15 minutes prior to the call, in order to register, download and install any necessary audio software. The webcast will be available until May 8, 2009.
Following the launch in February of ST-Ericsson, the 50-50 joint venture between STMicroelectronics and Ericsson, beginning this quarter the results of the wireless business will be released separately and discussed by ST-Ericsson’s management. ST-Ericsson will release its earnings after 5:00 p.m. U.S. Eastern Time / 11:00 p.m. CET on April 29, 2009. Management of the JV will host a conference call to discuss ST-Ericsson’s performance on April 30, 2009 at 7:00 a.m. U.S. Eastern Time / 1:00 p.m. CET.http://blog.360.yahoo.com/blog-wNfT0VU9bqt5f54S7cvO
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets. The Company’s shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company’s net revenues were $9.84 billion. Further information on ST can be found at http://lancesparrow.blogspot.com/.
The press release will be available immediately after the release on the Company’s website www.data-sheet.org .The management of STMicroelectronics will conduct a conference call on April 30, 2009 at 9:00 a.m. U.S. Eastern Time / 3:00 p.m. CET, to discuss performance for the first quarter of 2009.
The conference call will be available via the Internet by accessing the following Web address: www.okdatasheet.com . Those accessing the webcast should go to the Web site at least 15 minutes prior to the call, in order to register, download and install any necessary audio software. The webcast will be available until May 8, 2009.
Following the launch in February of ST-Ericsson, the 50-50 joint venture between STMicroelectronics and Ericsson, beginning this quarter the results of the wireless business will be released separately and discussed by ST-Ericsson’s management. ST-Ericsson will release its earnings after 5:00 p.m. U.S. Eastern Time / 11:00 p.m. CET on April 29, 2009. Management of the JV will host a conference call to discuss ST-Ericsson’s performance on April 30, 2009 at 7:00 a.m. U.S. Eastern Time / 1:00 p.m. CET.http://blog.360.yahoo.com/blog-wNfT0VU9bqt5f54S7cvO
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets. The Company’s shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company’s net revenues were $9.84 billion. Further information on ST can be found at http://lancesparrow.blogspot.com/.
7 Good Twitter Monetization Strategies
I've been getting into Twitter (under my usual moniker - randfish) more and more over time (despite only following a few friends and family), and lately, its been weighing on me that the service, despite its brilliance, rapid adoption and passionate fanbase, isn't yet pursuing revenue. That's OK - I think they probably have lots of very smart, talented, experience people thinking about the problem and taking action to prepare for it. However, I thought it might be fun to brainstorm some concepts publicly and recruit the smart SEO crowd to pitch in.
First off, here are the ideas I'd toss - I don't think they make good sense. Thumbs down to:
Third-Party Contextual Advertising - Google AdSense or YPN just don't excite me, and I think they'd undermonetize and be limited to only those folks who use Twitter on the web (and not through third party apps or mobile).
Broadcast Tweet Ads - Sending users a random ad tweet every 5, 10 or even 50 tweets isn't exciting and it's not targeted the way Twitter should be. Twitter knows something about everyone; leverage that if you're going to message your users.
Display Ads - For the same reasons as contextual advertising
Third Party Aps & APIs - I love that it's free now, and I think Twitter will be far more valuable by remaining completely free to users and open to developers.
Pay for Corporate Accounts - Can't prove you're a real person? Twitter charges for your corporate/brand account. It's an easy one (even if people set up lots of sock puppets to get around it, Twitter's sales/spam team can go find the valuable accounts), but it doesn't have the targeting value or the potential that some of the others do.
Pay for Followers - Twitter fans are going to get angry quickly if you auto-sign them up to follow a brand or person they don't know. I'd stay far away from this one.
Pay for Followed Links - Something tells me Google would be pretty quick to penalize Twitter and they probably don't want to make enemies with the search giant just yet. :-)
And here's some ideas I really like:
Keyword Purchases - Every time someone Tweets the word "SEOmoz," I, as an advertiser, want two things. First, I want those users recorded so I can message to them in the future and second, I want the word to automatically become a link pointing to the page of my choosing (probably a Twitter-specific landing page for PRO in our case).
Search Ads on Twitter Search - As Twitter search becomes more popular (and it will, not just for obsessed Twitterers, brand managers and reputation analysts, but for regular users and marketers and researchers, too), placing relevant ads in those searches becomes valuable. Better yet, you can combine Twitter searches with tweet history, so I could, for example, only show my ad to Twitter users who search for "SEO" and have previously twittered (or received twitters from those they follow) with my brand name.
Charging for Power Accounts - Your first 1,000 followers are free. After that, no one can follow you until you pay $50 a year (or some nominal, but affordable number). When you get to 5,000 or 10,000, the price goes up.
Subscribe Invitations from Advertisers - When I log into Twitter or reach my account page on the site, an overlay could indicate that some users have invited me to follow them. Those "invitations" could have 140 characters to say something clever and enticing enough to attract me and Twitter could target them based on my followers, followees and tweet history. There's a lot of targeting options for a brand manager seeking new followers.
Targeted Tweet Ads Based on Tweet History - Unlike the broadcast ad concept I didn't like above, these would rely on user history and profile to make them effective. If I've tweeted a combination of words a number of times or follow people who have, I'm an ideal candidate to receive a sponsored tweet every 20 or 50.
Opt-In Geo-Tweet Ads - You Tweet a location and advertisers can Tweet back (and appear in your mobile updates) with messaging. It's a pretty solid concept, although I worry that opt-in adoption rates would be low unless the advertiser quality controls were extremely high.
Pay to Opt Out of Ads - Don't want to receive Tweet ads or sponsored tweets (and maybe get some extra member features like a more robust timeline and maybe greater visibility or listing in some sort of Twitter user directory)? Pay $3 or $6 or $9 a month. It's a great extra revenue stream for those who'd (inevitably) complain about the ads.
Your turn - any good ideas for how Twitter should monetize? Any guesses as to which they'll adopt and when?
p.s. I recognize that many folks around the web have probably already voiced these ideas, and I've glanced at a few headlines on the topic, but thought I'd come at it independently without reading anything else first. If this were my job, I'd approach it much more systematically.
First off, here are the ideas I'd toss - I don't think they make good sense. Thumbs down to:
Third-Party Contextual Advertising - Google AdSense or YPN just don't excite me, and I think they'd undermonetize and be limited to only those folks who use Twitter on the web (and not through third party apps or mobile).
Broadcast Tweet Ads - Sending users a random ad tweet every 5, 10 or even 50 tweets isn't exciting and it's not targeted the way Twitter should be. Twitter knows something about everyone; leverage that if you're going to message your users.
Display Ads - For the same reasons as contextual advertising
Third Party Aps & APIs - I love that it's free now, and I think Twitter will be far more valuable by remaining completely free to users and open to developers.
Pay for Corporate Accounts - Can't prove you're a real person? Twitter charges for your corporate/brand account. It's an easy one (even if people set up lots of sock puppets to get around it, Twitter's sales/spam team can go find the valuable accounts), but it doesn't have the targeting value or the potential that some of the others do.
Pay for Followers - Twitter fans are going to get angry quickly if you auto-sign them up to follow a brand or person they don't know. I'd stay far away from this one.
Pay for Followed Links - Something tells me Google would be pretty quick to penalize Twitter and they probably don't want to make enemies with the search giant just yet. :-)
And here's some ideas I really like:
Keyword Purchases - Every time someone Tweets the word "SEOmoz," I, as an advertiser, want two things. First, I want those users recorded so I can message to them in the future and second, I want the word to automatically become a link pointing to the page of my choosing (probably a Twitter-specific landing page for PRO in our case).
Search Ads on Twitter Search - As Twitter search becomes more popular (and it will, not just for obsessed Twitterers, brand managers and reputation analysts, but for regular users and marketers and researchers, too), placing relevant ads in those searches becomes valuable. Better yet, you can combine Twitter searches with tweet history, so I could, for example, only show my ad to Twitter users who search for "SEO" and have previously twittered (or received twitters from those they follow) with my brand name.
Charging for Power Accounts - Your first 1,000 followers are free. After that, no one can follow you until you pay $50 a year (or some nominal, but affordable number). When you get to 5,000 or 10,000, the price goes up.
Subscribe Invitations from Advertisers - When I log into Twitter or reach my account page on the site, an overlay could indicate that some users have invited me to follow them. Those "invitations" could have 140 characters to say something clever and enticing enough to attract me and Twitter could target them based on my followers, followees and tweet history. There's a lot of targeting options for a brand manager seeking new followers.
Targeted Tweet Ads Based on Tweet History - Unlike the broadcast ad concept I didn't like above, these would rely on user history and profile to make them effective. If I've tweeted a combination of words a number of times or follow people who have, I'm an ideal candidate to receive a sponsored tweet every 20 or 50.
Opt-In Geo-Tweet Ads - You Tweet a location and advertisers can Tweet back (and appear in your mobile updates) with messaging. It's a pretty solid concept, although I worry that opt-in adoption rates would be low unless the advertiser quality controls were extremely high.
Pay to Opt Out of Ads - Don't want to receive Tweet ads or sponsored tweets (and maybe get some extra member features like a more robust timeline and maybe greater visibility or listing in some sort of Twitter user directory)? Pay $3 or $6 or $9 a month. It's a great extra revenue stream for those who'd (inevitably) complain about the ads.
Your turn - any good ideas for how Twitter should monetize? Any guesses as to which they'll adopt and when?
p.s. I recognize that many folks around the web have probably already voiced these ideas, and I've glanced at a few headlines on the topic, but thought I'd come at it independently without reading anything else first. If this were my job, I'd approach it much more systematically.
2009年4月22日星期三
Buying Expired Domains: What's the Best Strategy?
Lately I've noticed a lot of questions in Q&A centering on purchasing expired domains. A lot of our members have expressed interest in buying old domains for a variety of prices (some are cheap, some are going for upwards of $50k) and want some advice on what to do with the domains once they've been purchased. I'm no domainer, nor am I an expert in such a business tactic, but I generally recommend one of three different options for an expired domain (and would love to hear more if you've got any). Option #1: 301 Redirect the Old Domain to Your Existing DomainThe easiest and least time consuming option is to 301 redirect the old domain to your existing site. This tactic obviously works best if both sites are in the same sector and are targeting the same keywords; otherwise, if you have a pet supply site and you buy an old Texas Hold 'Em poker site, a redirect probably might raise some eyebrows among the search engines. If, however, your site is brandnamepets.com and you buy onlinepetsupply.com and 301 redirect the domain over, you're inheriting a lot of topical and appropriate links. PROS:
Is the least time consuming option
Benefit from the value (about 95% or so) of the old domain's links CONS:
Old branded anchor text pointing to your new site isn't going to help as much as a keyword-rich anchor text
If the old site had a penalty (for shady link building, cloaking, spamming, etc.), the penalty could carry over to your new site (I can't confirm this to be true, but a lot of SEOs I've talked to believe that this is a possibility, and some have sworn that they've experienced it firsthand, so I guess you just have to be cautious) Option #2: Create a Microsite That Links to Your Existing DomainThe second option requires a bit more time and effort than a 301 redirect. You could do a mini overhaul of the site and turn it into a microsite for your main domain. This option is good for exact-match domains for your targeted keyword, and there are other reasons for going the microsite route that Rand's highlighted in his post about root domains, subdomains, subfolders and microsites. This strategy also works better if the old domain has decent rankings for the keywords you're targeting. PROS:
Can cross-promote/cross-link to your existing site
More real estate in the SERPs means more branding and potential conversions for your site
You can do stuff on your microsite you may not want to do with your main site (e.g., launch silly viral content, experiment with a promotional tactic)
You don't have to have a completely robust site; a lot of microsites are smaller and have a single focus (e.g., center on a quiz or a centric idea) CONS:
Can be time-consuming to do an overhaul of the old site
Aggressive promotion and linking to the existing domain can seem spammy and you could get penalized for reciprocal linking or setting up a link farm
Your current site isn't inheriting any of the old site's link value that would have come via a 301 redirect
Microdomains can be used ineffectively (see Rand's Whiteboard Friday about the microsite mistake) Option #3: Overhaul the Old Domain and Operate It IndependentlyThe third option is the one that's the most time consuming but also has its benefits. It's like having a successful restaurant and buying another restaurant and operating them simultaneously. They're not the exact same restaurant, but both are popular in their own right and make you money. The same goes for Option #3. You could update the content on the old domain and sell the same products that you're selling on your current site. If you can get both sites to rank alongside each other in the SERPs, you're increasing your conversion chances and sales potential. PROS:
As with Option #2, you get more real estate in the SERPs if you can get both sites to rank for your targeted search terms
You don't have to work hard to brand the old site if it's a generic, keyword-rich domain--you can just focus on getting rankings and conversions
The old site already has links pointing to it and is more established than starting with a brand new domain CONS:
You have to ensure that the old site doesn't mimic the new site and runs into any duplicate content issues
It's time consuming to revamp and maintain the old site (you've essentially doubled your workload)
As with Option #2, aggressive cross linking between the sites can raise red flags Your course of action really depends on how much work and effort you can put into the expired domain. If you're barely able to maintain and optimize your current site, you probably want to just 301 redirect the old site. If, however, you're more creative and have some time on your hands, you can try your hand at crafting a microsite. If you really know your stuff and are experienced at making money off various websites, you'd probably do well with the third option. Here's where I open things up: do any of you have experience buying old domains? If so, what do you do with them and has your decision worked well for you? Are there any other strategies you recommend?
reprint from:http://www.seomoz.org/blog/buying-expired-domains-whats-the-best-strategy
Is the least time consuming option
Benefit from the value (about 95% or so) of the old domain's links CONS:
Old branded anchor text pointing to your new site isn't going to help as much as a keyword-rich anchor text
If the old site had a penalty (for shady link building, cloaking, spamming, etc.), the penalty could carry over to your new site (I can't confirm this to be true, but a lot of SEOs I've talked to believe that this is a possibility, and some have sworn that they've experienced it firsthand, so I guess you just have to be cautious) Option #2: Create a Microsite That Links to Your Existing DomainThe second option requires a bit more time and effort than a 301 redirect. You could do a mini overhaul of the site and turn it into a microsite for your main domain. This option is good for exact-match domains for your targeted keyword, and there are other reasons for going the microsite route that Rand's highlighted in his post about root domains, subdomains, subfolders and microsites. This strategy also works better if the old domain has decent rankings for the keywords you're targeting. PROS:
Can cross-promote/cross-link to your existing site
More real estate in the SERPs means more branding and potential conversions for your site
You can do stuff on your microsite you may not want to do with your main site (e.g., launch silly viral content, experiment with a promotional tactic)
You don't have to have a completely robust site; a lot of microsites are smaller and have a single focus (e.g., center on a quiz or a centric idea) CONS:
Can be time-consuming to do an overhaul of the old site
Aggressive promotion and linking to the existing domain can seem spammy and you could get penalized for reciprocal linking or setting up a link farm
Your current site isn't inheriting any of the old site's link value that would have come via a 301 redirect
Microdomains can be used ineffectively (see Rand's Whiteboard Friday about the microsite mistake) Option #3: Overhaul the Old Domain and Operate It IndependentlyThe third option is the one that's the most time consuming but also has its benefits. It's like having a successful restaurant and buying another restaurant and operating them simultaneously. They're not the exact same restaurant, but both are popular in their own right and make you money. The same goes for Option #3. You could update the content on the old domain and sell the same products that you're selling on your current site. If you can get both sites to rank alongside each other in the SERPs, you're increasing your conversion chances and sales potential. PROS:
As with Option #2, you get more real estate in the SERPs if you can get both sites to rank for your targeted search terms
You don't have to work hard to brand the old site if it's a generic, keyword-rich domain--you can just focus on getting rankings and conversions
The old site already has links pointing to it and is more established than starting with a brand new domain CONS:
You have to ensure that the old site doesn't mimic the new site and runs into any duplicate content issues
It's time consuming to revamp and maintain the old site (you've essentially doubled your workload)
As with Option #2, aggressive cross linking between the sites can raise red flags Your course of action really depends on how much work and effort you can put into the expired domain. If you're barely able to maintain and optimize your current site, you probably want to just 301 redirect the old site. If, however, you're more creative and have some time on your hands, you can try your hand at crafting a microsite. If you really know your stuff and are experienced at making money off various websites, you'd probably do well with the third option. Here's where I open things up: do any of you have experience buying old domains? If so, what do you do with them and has your decision worked well for you? Are there any other strategies you recommend?
reprint from:http://www.seomoz.org/blog/buying-expired-domains-whats-the-best-strategy
STMicroelectronics Posts its 2008 Statutory Accounts on its Website
Geneva, April 22, 2009 - STMicroelectronics (NYSE: STM) has posted its 2008 Statutory Accounts on its Company website and has filed them with its Dutch regulator, the AFM (Authority for the Financial Markets). About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets. The Company’s shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company’s net revenues were $9.84 billion. Further information on ST can be found at www.data-sheet.org
2009年4月21日星期二
Introduction to SDCC: Small Device C Compiler
SDCCis a Freeware, retargettable, optimizing ANSI - C compiler that targets the Intel 8051, Maxim 5962-0051101NXD , Zilog Z80 and the Motorola 68HC08 based MCUs. Work is in progress on supporting the Microchip PIC16 and PIC18 series. AVR and gbz80 ports are no longer maintained. The entire source code for the compiler is distributed under GPL.
Some of the features include:
ASXXXX and ASLINK, a Freeware, retargettable assembler and linker.
extensive MCU specific language extensions, allowing effective use of the underlying hardware.
a host of standard optimizations such as global sub expression elimination, loop optimizations (loop invariant, strength reduction of induction variables and loop reversing ), constant folding and propagation, copy propagation, dead code elimination and jump tables for 'switch' statements.
MCU specific optimisations, including a global register allocator.
adaptable MCU specific backend that should be well suited for other 8 bit MCUs
independent rule based peep hole optimizer.
a full range of data types: char (8 bits, 1 byte), short (16 bits, 2 bytes), int (16 bits, 2 bytes), long (32 bit, 4 bytes) and float (4 byte IEEE).
the ability to add inline assembler code anywhere in a function.
the ability to report on the complexity of a function to help decide what should be re-written in assembler.
a good selection of automated regression tests.
SDCC also comes with the source level debugger 5962-0051201QHA , using the current version of Daniel's s51 simulator. (Currently not available on Win32 platforms).
SDCC was written by Sandeep Dutta and released under a GPL license. Since its initial release there have been numerous bug fixes and improvements. As of December 1999, the code was moved to SourceForge where all the "users turned developers" can access the same source tree. SDCC is constantly being updated with all the users' and developers' input.
Some of the features include:
ASXXXX and ASLINK, a Freeware, retargettable assembler and linker.
extensive MCU specific language extensions, allowing effective use of the underlying hardware.
a host of standard optimizations such as global sub expression elimination, loop optimizations (loop invariant, strength reduction of induction variables and loop reversing ), constant folding and propagation, copy propagation, dead code elimination and jump tables for 'switch' statements.
MCU specific optimisations, including a global register allocator.
adaptable MCU specific backend that should be well suited for other 8 bit MCUs
independent rule based peep hole optimizer.
a full range of data types: char (8 bits, 1 byte), short (16 bits, 2 bytes), int (16 bits, 2 bytes), long (32 bit, 4 bytes) and float (4 byte IEEE).
the ability to add inline assembler code anywhere in a function.
the ability to report on the complexity of a function to help decide what should be re-written in assembler.
a good selection of automated regression tests.
SDCC also comes with the source level debugger 5962-0051201QHA , using the current version of Daniel's s51 simulator. (Currently not available on Win32 platforms).
SDCC was written by Sandeep Dutta and released under a GPL license. Since its initial release there have been numerous bug fixes and improvements. As of December 1999, the code was moved to SourceForge where all the "users turned developers" can access the same source tree. SDCC is constantly being updated with all the users' and developers' input.
2009年4月20日星期一
Photocouplers with Reinforced Insulation in the New SO6 Package: TLP109,TLP116A
The TLP109 and TLP116A are new additions to Toshiba's photocoupler family in small surface-mount packages. The new photocouplers are housed in the SO6 package, which is pin-compatible with the conventional MFSOP6 package. However, the maximum PCB mounted height has been reduced from 2.8 mm to 2.3 mm, making them ideal for low-profile applications. Additionally, for reinforced insulation, the TLP109 and TLP116A offer clearance and creepage distances of 5 mm or more and an internal Faraday shield with a thickness of 0.4 mm or more. SO6 meets the customer needs for both a thin package and a high level of safety standard compliance, bringing added value to your system.
Features
Packaging Features
Isolation voltage = 3750Vrms
Clearance and creepage distances = 5mm(min)
Internal Faraday shield = 0.4mm thick (min)
Product Offerings
TLP109：General-purpose open-collector outputData transfer rate = 1Mbps(typ.)VCC = 30V(max)
TLP116A：High-speed totem-pole outputData transfer rate = 20Mbps(typ.)VCC = 4.5 to 5.5V
Features
Packaging Features
Isolation voltage = 3750Vrms
Clearance and creepage distances = 5mm(min)
Internal Faraday shield = 0.4mm thick (min)
Product Offerings
TLP109：General-purpose open-collector outputData transfer rate = 1Mbps(typ.)VCC = 30V(max)
TLP116A：High-speed totem-pole outputData transfer rate = 20Mbps(typ.)VCC = 4.5 to 5.5V
2009年4月19日星期日
STMicroelectronics Supervisory Board Resolves
Geneva, April 15, 2009 – The Supervisory Board of STMicroelectronics (NYSE:STM) today approved a proposal to submit to the forthcoming 2009 Annual General Meeting of Shareholders the distribution of a cash dividend of $0.12 per outstanding share of the Company’s common stock, payable in four quarterly installments from 2nd quarter 2009 through the 1st quarter 2010. The proposed dividend equals a 2% yield on the Company’s share price at closing yesterday on the NYSE.
The proposal will be submitted for shareholder approval at the Company’s Annual General Meeting, which will be held in Amsterdam on May 20, 2009.
The Company’s quarterly dividend of $0.03 per share, as proposed, compares to a quarterly dividend of $0.09 per share paid in the last twelve months.
“One of our key priorities for the Company in 2009 is to maintain a solid financial foundation and to further strengthen our Company for the long-term. As we navigate the current macro-economic environment, we have decided to maintain our dividend policy involving the distribution of a cash dividend, but are proposing, on a temporary basis, to reduce its level, reflecting today’s unstable market,” http://bg.data-sheet.org/datasheet_pdf/B/Z/BZW06-213B.html said.
Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) based on management’s current views and assumptions and involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those in such statements. Such forward-looking statements can be identified by the use of forward-looking terminology such as “believes,” “may,” “will,” “should,” “would be” or “anticipates” or similar expressions or the negative thereof or other variations thereof, or by discussions of strategy, plans or intentions. Some of the risk factors we face are set forth and are discussed in more detail in “Item 3. Key Information—Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2007, as filed with the SEC on March 3, 2008 and in our press release dated January 27, 2009 filed with the SEC under form 6-K on January 28th. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.
Unfavorable changes in the above or other factors listed under “Risk Factors” from time to time in our SEC filings, including our Form 20-F, could have a material adverse effect on our results of operations or financial condition.
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets. The Company’s shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company’s net revenues were $9.84 billion. Further information on ST can be found at www.data-sheet.org
The proposal will be submitted for shareholder approval at the Company’s Annual General Meeting, which will be held in Amsterdam on May 20, 2009.
The Company’s quarterly dividend of $0.03 per share, as proposed, compares to a quarterly dividend of $0.09 per share paid in the last twelve months.
“One of our key priorities for the Company in 2009 is to maintain a solid financial foundation and to further strengthen our Company for the long-term. As we navigate the current macro-economic environment, we have decided to maintain our dividend policy involving the distribution of a cash dividend, but are proposing, on a temporary basis, to reduce its level, reflecting today’s unstable market,” http://bg.data-sheet.org/datasheet_pdf/B/Z/BZW06-213B.html said.
Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) based on management’s current views and assumptions and involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those in such statements. Such forward-looking statements can be identified by the use of forward-looking terminology such as “believes,” “may,” “will,” “should,” “would be” or “anticipates” or similar expressions or the negative thereof or other variations thereof, or by discussions of strategy, plans or intentions. Some of the risk factors we face are set forth and are discussed in more detail in “Item 3. Key Information—Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2007, as filed with the SEC on March 3, 2008 and in our press release dated January 27, 2009 filed with the SEC under form 6-K on January 28th. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.
Unfavorable changes in the above or other factors listed under “Risk Factors” from time to time in our SEC filings, including our Form 20-F, could have a material adverse effect on our results of operations or financial condition.
About STMicroelectronicsSTMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today’s convergence markets. The Company’s shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2008, the Company’s net revenues were $9.84 billion. Further information on ST can be found at www.data-sheet.org
2009年4月18日星期六
IMPORTANT NOTICETexas
IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products Applications'
2009年4月17日星期五
STMicroelectronics Reports on Main Resolutions to be Proposed at the 2009 Annual General Meeting of Shareholders
Geneva, April 16, 2009 - ST Microelectronics (NYSE: STM) has announced the main resolutions to be submitted for shareholder approval at the Company’s Annual
General Meeting, which will be held in Amsterdam on May 20, 2009.
The Main ResolutionsThe main resolutions, proposed by the Supervisory Board, include:
Approval of the Company's 2008 accounts reported in accordance with International Financial Reporting Standards (IFRS); The reappointment for a three-year term, expiring at the 2012 Annual General Meeting, for the following members of the Supervisory Board: Mr. Doug Dunn and
Mr. Didier Lamouche; The distribution of a cash dividend of US$0.12 per share, to be paid in four equal quarterly installments, as further explained below. The Record Date for Annual General Meeting ParticipationThe record date for all shareholders to participate at the Annual General Meeting will be April 28, 2009. The complete agenda and all relevant detailed
information concerning the STMicroelectronics N.V. Annual General Meeting, as well as all related AGM materials, will be available on the Company’s web site
and made available to shareholders in compliance with legal requirements.
The Record and Payment Dates for DividendsAs indicated above, the resolution proposed by the Supervisory Board foresees the distribution of a cash dividend of US$0.12 per share, to be paid in four
equal quarterly installments in May, August and November 2009 and February 2010 to shareholders of record in the month of each quarterly payment.
If approved, for the first installment, the Company's common shares will trade ex-dividend on Euronext Paris and the Milan Stock Exchange (1.5KE250CA),
on Monday, May 25, 2009, and the payment date will be Thursday, May 28, 2009. For holders of shares listed on the New York Stock Exchange, shares will trade
ex-dividend on Friday, May 22, 2009, the record date will be Wednesday, May 27, 2009, and the payment date will be on or after Tuesday, June 2, 2009.
Transfers between New York and European (Dutch) registered shares will be closed from the end of business in Europe on Friday, May 22, 2009, until the open
of business in New York on Thursday, May 28, 2009.
The table below summarizes the full schedule for the four installments
General Meeting, which will be held in Amsterdam on May 20, 2009.
The Main ResolutionsThe main resolutions, proposed by the Supervisory Board, include:
Approval of the Company's 2008 accounts reported in accordance with International Financial Reporting Standards (IFRS); The reappointment for a three-year term, expiring at the 2012 Annual General Meeting, for the following members of the Supervisory Board: Mr. Doug Dunn and
Mr. Didier Lamouche; The distribution of a cash dividend of US$0.12 per share, to be paid in four equal quarterly installments, as further explained below. The Record Date for Annual General Meeting ParticipationThe record date for all shareholders to participate at the Annual General Meeting will be April 28, 2009. The complete agenda and all relevant detailed
information concerning the STMicroelectronics N.V. Annual General Meeting, as well as all related AGM materials, will be available on the Company’s web site
and made available to shareholders in compliance with legal requirements.
The Record and Payment Dates for DividendsAs indicated above, the resolution proposed by the Supervisory Board foresees the distribution of a cash dividend of US$0.12 per share, to be paid in four
equal quarterly installments in May, August and November 2009 and February 2010 to shareholders of record in the month of each quarterly payment.
If approved, for the first installment, the Company's common shares will trade ex-dividend on Euronext Paris and the Milan Stock Exchange (1.5KE250CA),
on Monday, May 25, 2009, and the payment date will be Thursday, May 28, 2009. For holders of shares listed on the New York Stock Exchange, shares will trade
ex-dividend on Friday, May 22, 2009, the record date will be Wednesday, May 27, 2009, and the payment date will be on or after Tuesday, June 2, 2009.
Transfers between New York and European (Dutch) registered shares will be closed from the end of business in Europe on Friday, May 22, 2009, until the open
of business in New York on Thursday, May 28, 2009.
The table below summarizes the full schedule for the four installments
2009年4月16日星期四
power management
UHF Transceiver/Transmitter/Receiver: Pin-to-pin and software compatible devices are available offering a easy way of scalability from standard one way communication to high-end bi-directional communication. The UHF device family comes with an easy to use SPI interface where all parameters of a UHF link could be configured. All building blocks of a ti Datasheet system are integrated in the devices requiring only one external oscillator, a matching network and the UHF antenna itself. The receiver and transceiver comes with a integrated polling mode (wake on radio).
Power management: The power supply is connected to the 12V or 24V board net and regulates down/up to voltages for DSP, uC, memory and ICs and functions DVD drive, communication interfaces, display biasing and back lighting. The need for many different power rails makes the design of the power supply a critical task when trying to design for size, cost and efficiency. Linear regulators with low quiescent current help reduce battery leakage current during standby operating modes (ignition off), are load dump voltage tolerant for directly battery connected devices, and need low drop out and tracking for low battery crank operation. Beyond providing increased conversion efficiencies, switching power supplies provide EMI improvement with slew rate control of the switching FET, Frequency hopping, spread spectrum or triangulation method for attenuation of peak spectral energy, Low Iq, soft start for power sequencing and in rush current limitation, Phased switching for multiple SMPS's regulators to minimize input ripple current and lower input capacitance, higher switching frequency for smaller components (74FCT162652ATPVCT ), and SVS functions for brown out indications.
Power management: The power supply is connected to the 12V or 24V board net and regulates down/up to voltages for DSP, uC, memory and ICs and functions DVD drive, communication interfaces, display biasing and back lighting. The need for many different power rails makes the design of the power supply a critical task when trying to design for size, cost and efficiency. Linear regulators with low quiescent current help reduce battery leakage current during standby operating modes (ignition off), are load dump voltage tolerant for directly battery connected devices, and need low drop out and tracking for low battery crank operation. Beyond providing increased conversion efficiencies, switching power supplies provide EMI improvement with slew rate control of the switching FET, Frequency hopping, spread spectrum or triangulation method for attenuation of peak spectral energy, Low Iq, soft start for power sequencing and in rush current limitation, Phased switching for multiple SMPS's regulators to minimize input ripple current and lower input capacitance, higher switching frequency for smaller components (74FCT162652ATPVCT ), and SVS functions for brown out indications.
Passive entry
Passive Entry: The Passive Entry Device manages the Immobilizer communication, push button interaction and LF wake reception. The special high Q design achieves communication ranges up to 3m for the passive entry link without outstanding low standby current on the receiver side. The front-end offers flexible configuration of 2 different wake patterns of 74ACT16652DL 4, 8 or 16 bit length. Each channel could be adjusted in sensitivity and resonance frequency which results in reproducible system designs. By pressing a push button the device wakes up and controls an external UHF transmitter or transceiver. Security keys and rolling codes could be stored in the integrated EEPROM memory. This memory is accessible over the LF interface without support from the battery in the keyfob. The Passive Entry Device offers a special battery backup mode to operate the microcontroller without battery support. The external resonant circuit with a 74ACT16657DLR coil and a resonant capacitor could be trimmed to the correct resonant frequency with the integrated trimming capability achieving a easy way to eliminate part tolerances.
remote keyless
Remote Keyless Entry: The Controller Entry Device manages the Immobilizer communication and push button interaction. During sleep state the devices enters a special low power mode with only 60nA current consumption. By pressing a push button the device wakes up and controls an external UHF transmitter or transceiver. Security keys and rolling codes could be stored in the integrated EEPROM memory. This TI s accessible over the LF interface without support from the battery in the key fob. The Controller Entry Device offers a special battery charge mode; to achieve faster charging it’s recommend to add a charging amplifier device on the base station side. The external resonant circuit with a 74A coil and a resonant capacitor could be trimmed to the correct resonant frequency with the integrated trimming capability achieving an easy way to eliminate part tolerances.
car access functions
Very common car access functions are the immobilizer and the remote keyless entry system. For more advanced systems passive entry and passive start functions are implemented that allow unlocking or starting of the car by simply getting close to it.
TI RFID Automotive products offer market unique features and performance. All car side products are optimized for full integration into the Central Body Control Module (BCM). The Immobilizer LF antenna could be easily connected to the LF base station with a flexible cable length up to 13 feet (4m). The cable length could be varied without changing the adaptation to the base station. The integration of the base station reduces system component count and space requirements.
Immobilizer: The LF Immobilizer interface of all TI products works with a special half duplex transmission achieving market leading communication range resulting in flexible LF antenna placement at the key fob side and compact key fob design. TI offers compatible parts for the key fob from the transponder, over remote keyless entry controller to passive entry devices. All Immobilizer interfaces work without battery support on the key fob side.
TI RFID Automotive products offer market unique features and performance. All car side products are optimized for full integration into the Central Body Control Module (BCM). The Immobilizer LF antenna could be easily connected to the LF base station with a flexible cable length up to 13 feet (4m). The cable length could be varied without changing the adaptation to the base station. The integration of the base station reduces system component count and space requirements.
Immobilizer: The LF Immobilizer interface of all TI products works with a special half duplex transmission achieving market leading communication range resulting in flexible LF antenna placement at the key fob side and compact key fob design. TI offers compatible parts for the key fob from the transponder, over remote keyless entry controller to passive entry devices. All Immobilizer interfaces work without battery support on the key fob side.
Digital video recorders
Digital video recorders (DVR) and digital video servers (SVR) are appliances used in video surveillance. The DVR/SVR takes the analog video signals from multiple analog surveillance cameras and digitizes them. A processing engine encodes the video streams in digital formats such as H.264, motion JPEG, TI or proprietary codecs.
A DVR is designed to store and view this video stream locally. An SVR sends the encoded video to the larger security network using the TCP/IP protocol. Higher performance DVRs/SVRs also have analytical capabilities allowing for the automatic detection of motion, crossing of virtual fences, etc.
DVRs and SVRs are used to upgrade existing security systems, which are based on analog surveillance cameras. Replacing tape-based VCRs, the DVR/SVR automates the storage of surveillance data sheet and enables remote access to surveillance installations via TCP/IP networks. DVRs/SVRs typically have 4-, 8- or 16-input channels. With further integration, the channel count will increase to 32, 64 and beyond.
A DVR is designed to store and view this video stream locally. An SVR sends the encoded video to the larger security network using the TCP/IP protocol. Higher performance DVRs/SVRs also have analytical capabilities allowing for the automatic detection of motion, crossing of virtual fences, etc.
DVRs and SVRs are used to upgrade existing security systems, which are based on analog surveillance cameras. Replacing tape-based VCRs, the DVR/SVR automates the storage of surveillance data sheet and enables remote access to surveillance installations via TCP/IP networks. DVRs/SVRs typically have 4-, 8- or 16-input channels. With further integration, the channel count will increase to 32, 64 and beyond.
2009年4月15日星期三
BC846BWT1,BC847ALT1,BC847ALT1,BC847AWT1,BC847BWT1,BC847CLT1,BC847CWT1,BC848ALT1
BC846BWT1
motorola
NPN silicon general purpose transistor
BC847ALT1
motorola
NPN silicon general purpose transistor
BC847ALT1
motorola
NPN silicon general purpose transistor
BC847AWT1
motorola
NPN silicon general purpose transistor
BC847BWT1
motorola
NPN silicon general purpose transistor
BC847CLT1
motorola
NPN silicon general purpose transistor
BC847CWT1
motorola
NPN silicon general purpose transistor
BC848ALT1
motorola
NPN silicon general purpose transistor
BC848AWT1
motorola
NPN silicon general purpose transistor
BC848BLT1
motorola
NPN silicon general purpose transistor
BC848BWT1
motorola
NPN silicon general purpose transistor
BC848CWT1
motorola
NPN silicon general purpose transistor
BC849ALT1
motorola
NPN silicon general purpose transistor
BC849BLT1
motorola
NPN silicon general purpose transistor
BC849CLT1
motorola
NPN silicon general purpose transistor
BC850ALT1
motorola
NPN silicon general purpose transistor
BC850BLT1
motorola
NPN silicon general purpose transistor
BC850CLT1
motorola
NPN silicon general purpose transistor
BC856ALT1
motorola
PNP silicon general purpose transistor
BC856AWT1
motorola
PNP silicon general purpose transistor
BC856BLT1
motorola
PNP silicon general purpose transistor
BC856BWT1
motorola
PNP silicon general purpose transistor
BC857ALT1
motorola
PNP silicon general purpose transistor
BC857AWT1
motorola
PNP silicon general purpose transistor
BC857BLT1
motorola
PNP silicon general purpose transistor
BC857CLT1
motorola
PNP silicon general purpose transistor
BC858ALT1
motorola
PNP silicon general purpose transistor
BC858AWT1
motorola
PNP silicon general purpose transistor
BC858BLT1
motorola
PNP silicon general purpose transistor
BC858BWT1
motorola
PNP silicon general purpose transistor
motorola
NPN silicon general purpose transistor
BC847ALT1
motorola
NPN silicon general purpose transistor
BC847ALT1
motorola
NPN silicon general purpose transistor
BC847AWT1
motorola
NPN silicon general purpose transistor
BC847BWT1
motorola
NPN silicon general purpose transistor
BC847CLT1
motorola
NPN silicon general purpose transistor
BC847CWT1
motorola
NPN silicon general purpose transistor
BC848ALT1
motorola
NPN silicon general purpose transistor
BC848AWT1
motorola
NPN silicon general purpose transistor
BC848BLT1
motorola
NPN silicon general purpose transistor
BC848BWT1
motorola
NPN silicon general purpose transistor
BC848CWT1
motorola
NPN silicon general purpose transistor
BC849ALT1
motorola
NPN silicon general purpose transistor
BC849BLT1
motorola
NPN silicon general purpose transistor
BC849CLT1
motorola
NPN silicon general purpose transistor
BC850ALT1
motorola
NPN silicon general purpose transistor
BC850BLT1
motorola
NPN silicon general purpose transistor
BC850CLT1
motorola
NPN silicon general purpose transistor
BC856ALT1
motorola
PNP silicon general purpose transistor
BC856AWT1
motorola
PNP silicon general purpose transistor
BC856BLT1
motorola
PNP silicon general purpose transistor
BC856BWT1
motorola
PNP silicon general purpose transistor
BC857ALT1
motorola
PNP silicon general purpose transistor
BC857AWT1
motorola
PNP silicon general purpose transistor
BC857BLT1
motorola
PNP silicon general purpose transistor
BC857CLT1
motorola
PNP silicon general purpose transistor
BC858ALT1
motorola
PNP silicon general purpose transistor
BC858AWT1
motorola
PNP silicon general purpose transistor
BC858BLT1
motorola
PNP silicon general purpose transistor
BC858BWT1
motorola
PNP silicon general purpose transistor
2009年4月14日星期二
1SMB5936BT3,1SMB5937BT3,1SMB5937BT3,1SMB5938BT3,1SMB5938BT3,1SMB5939BT3
1SMB5936BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5937BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5937BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5938BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5938BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5939BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5940BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5940BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5940BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5940BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5941BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5941BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5942BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5942BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5943BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5943BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5943BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5944BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5944BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5945BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5945BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5946BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5946BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5947BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5947BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5948BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5948BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5949BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5949BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5950BT3
motorola
3 watt plastic surface mount silicon zener diodes
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5937BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5937BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5938BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5938BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5939BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5940BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5940BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5940BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5940BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5941BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5941BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5942BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5942BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5943BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5943BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5943BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5944BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5944BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5945BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5945BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5946BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5946BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5947BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5947BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5948BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5948BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5949BT3
motorola
3 watt plastic surface mount silicon zener diodes
1SMB5949BT3
motorola
3 watt plastic surface mount silicon zener diode
1SMB5950BT3
motorola
3 watt plastic surface mount silicon zener diodes
2009年4月13日星期一
1SMA70AT3,1SMA70CAT3,1SMA75AT3,1SMA78AT3,1SMA78CAT3,1SMA8.0AT3,1SMA8.0AT3,1SMA8
1SMA70AT3
motorola
Zener translent voltage suppressor
1SMA70CAT3
motorola
Zener translent voltage suppressor
1SMA75AT3
motorola
Zener translent voltage suppressor
1SMA78AT3
motorola
Zener translent voltage suppressor
1SMA78CAT3
motorola
Zener translent voltage suppressor
1SMA8.0AT3
motorola
Zener translent voltage suppressor
1SMA8.0AT3
motorola
Zener translent voltage suppressor
1SMA8.5AT3
motorola
Zener translent voltage suppressor
1SMA9.0AT3
motorola
Zener translent voltage suppressor
1SMA9.0AT3
motorola
Zener translent voltage suppressor
1SMB10AT3
motorola
600W peak power, 10 V zener transient suppressor
1SMB110AT3
motorola
600W peak power, 110 V zener transient suppressor
1SMB11AT3
motorola
600W peak power, 11 V zener transient suppressor
1SMB120AT3
motorola
600W peak power, 120 V zener transient suppressor
1SMB12AT3
motorola
600W peak power, 12 V zener transient suppressor
1SMB130AT3
motorola
600W peak power, 130 V zener transient suppressor
1SMB13AT3
motorola
600W peak power, 13 V zener transient suppressor
1SMB14AT3
motorola
600W peak power, 14 V zener transient suppressor
1SMB150AT3
motorola
600W peak power, 150 V zener transient suppressor
1SMB160AT3
motorola
600W peak power, 160 V zener transient suppressor
1SMB16AT3
motorola
600W peak power, 16 V zener transient suppressor
1SMB16AT3
motorola
600W peak power, 16 V zener transient suppressor
1SMB17AT3
motorola
600W peak power, 17 V zener transient suppressor
1SMB18AT3
motorola
600W peak power, 18 V zener transient suppressor
1SMB20AT3
motorola
600W peak power, 20 V zener transient suppressor
1SMB22AT3
motorola
600W peak power, 22 V zener transient suppressor
1SMB24AT3
motorola
600W peak power, 24 V zener transient suppressor
1SMB26AT3
motorola
600W peak power, 26 V zener transient suppressor
1SMB26AT3
motorola
600W peak power, 26 V zener transient suppressor
1SMB28AT3
motorola
600W peak power, 28 V zener transient suppressor
motorola
Zener translent voltage suppressor
1SMA70CAT3
motorola
Zener translent voltage suppressor
1SMA75AT3
motorola
Zener translent voltage suppressor
1SMA78AT3
motorola
Zener translent voltage suppressor
1SMA78CAT3
motorola
Zener translent voltage suppressor
1SMA8.0AT3
motorola
Zener translent voltage suppressor
1SMA8.0AT3
motorola
Zener translent voltage suppressor
1SMA8.5AT3
motorola
Zener translent voltage suppressor
1SMA9.0AT3
motorola
Zener translent voltage suppressor
1SMA9.0AT3
motorola
Zener translent voltage suppressor
1SMB10AT3
motorola
600W peak power, 10 V zener transient suppressor
1SMB110AT3
motorola
600W peak power, 110 V zener transient suppressor
1SMB11AT3
motorola
600W peak power, 11 V zener transient suppressor
1SMB120AT3
motorola
600W peak power, 120 V zener transient suppressor
1SMB12AT3
motorola
600W peak power, 12 V zener transient suppressor
1SMB130AT3
motorola
600W peak power, 130 V zener transient suppressor
1SMB13AT3
motorola
600W peak power, 13 V zener transient suppressor
1SMB14AT3
motorola
600W peak power, 14 V zener transient suppressor
1SMB150AT3
motorola
600W peak power, 150 V zener transient suppressor
1SMB160AT3
motorola
600W peak power, 160 V zener transient suppressor
1SMB16AT3
motorola
600W peak power, 16 V zener transient suppressor
1SMB16AT3
motorola
600W peak power, 16 V zener transient suppressor
1SMB17AT3
motorola
600W peak power, 17 V zener transient suppressor
1SMB18AT3
motorola
600W peak power, 18 V zener transient suppressor
1SMB20AT3
motorola
600W peak power, 20 V zener transient suppressor
1SMB22AT3
motorola
600W peak power, 22 V zener transient suppressor
1SMB24AT3
motorola
600W peak power, 24 V zener transient suppressor
1SMB26AT3
motorola
600W peak power, 26 V zener transient suppressor
1SMB26AT3
motorola
600W peak power, 26 V zener transient suppressor
1SMB28AT3
motorola
600W peak power, 28 V zener transient suppressor
2009年4月12日星期日
1N5939B,1N5940B,1N5941B,1N5942B,1N5943B,1N5944B,1N5945B
1N5939B
motorola
1 to 3 watt zener regulator diode
1N5940B
motorola
1 to 3 watt zener regulator diode
1N5941B
motorola
1 to 3 watt zener regulator diode
1N5942B
motorola
1 to 3 watt zener regulator diode
1N5943B
motorola
1 to 3 watt zener regulator diode
1N5944B
motorola
1 to 3 watt zener regulator diode
1N5945B
motorola
1 to 3 watt zener regulator diode
1N5945B
motorola
1 to 3 watt zener regulator diode
1N5946B
motorola
1 to 3 watt zener regulator diode
1N5946B
motorola
1 to 3 watt zener regulator diode
1N5947B
motorola
1 to 3 watt zener regulator diode
1N5947B
motorola
1 to 3 watt zener regulator diode
1N5948B
motorola
1 to 3 watt zener regulator diode
1N5950B
motorola
1 to 3 watt zener regulator diode
1N5951B
motorola
1 to 3 watt zener regulator diode
1N5952B
motorola
1 to 3 watt zener regulator diode
1N5953B
motorola
1 to 3 watt zener regulator diode
1N5954B
motorola
1 to 3 watt zener regulator diode
1N5955B
motorola
1 to 3 watt zener regulator diode
1N5956B
motorola
1 to 3 watt zener regulator diode
1N5985B
motorola
500 milliwatts glass silicon zener diode, zener voltage 2.4V
1N5986B
motorola
500 milliwatts glass silicon zener diode, zener voltage 2.7V
1N5987B
motorola
500 milliwatts glass silicon zener diode, zener voltage 3V
1N5988B
motorola
500 milliwatts glass silicon zener diode, zener voltage 3.3V
1N5989B
motorola
500 milliwatts glass silicon zener diode, zener voltage 3.6V
1N5990B
motorola
500 milliwatts glass silicon zener diode, zener voltage 3.9V
1N5992B
motorola
500 milliwatts glass silicon zener diode, zener voltage 4.7V
1N5993B
motorola
"500 milliwatts glass silicon zener diode, zener voltage 5.1V"
1N5994B
motorola
500 milliwatts glass silicon zener diode, zener voltage 5.6V
1N5995B
motorola
500 milliwatts glass silicon zener diode, zener voltage 6.2V
motorola
1 to 3 watt zener regulator diode
1N5940B
motorola
1 to 3 watt zener regulator diode
1N5941B
motorola
1 to 3 watt zener regulator diode
1N5942B
motorola
1 to 3 watt zener regulator diode
1N5943B
motorola
1 to 3 watt zener regulator diode
1N5944B
motorola
1 to 3 watt zener regulator diode
1N5945B
motorola
1 to 3 watt zener regulator diode
1N5945B
motorola
1 to 3 watt zener regulator diode
1N5946B
motorola
1 to 3 watt zener regulator diode
1N5946B
motorola
1 to 3 watt zener regulator diode
1N5947B
motorola
1 to 3 watt zener regulator diode
1N5947B
motorola
1 to 3 watt zener regulator diode
1N5948B
motorola
1 to 3 watt zener regulator diode
1N5950B
motorola
1 to 3 watt zener regulator diode
1N5951B
motorola
1 to 3 watt zener regulator diode
1N5952B
motorola
1 to 3 watt zener regulator diode
1N5953B
motorola
1 to 3 watt zener regulator diode
1N5954B
motorola
1 to 3 watt zener regulator diode
1N5955B
motorola
1 to 3 watt zener regulator diode
1N5956B
motorola
1 to 3 watt zener regulator diode
1N5985B
motorola
500 milliwatts glass silicon zener diode, zener voltage 2.4V
1N5986B
motorola
500 milliwatts glass silicon zener diode, zener voltage 2.7V
1N5987B
motorola
500 milliwatts glass silicon zener diode, zener voltage 3V
1N5988B
motorola
500 milliwatts glass silicon zener diode, zener voltage 3.3V
1N5989B
motorola
500 milliwatts glass silicon zener diode, zener voltage 3.6V
1N5990B
motorola
500 milliwatts glass silicon zener diode, zener voltage 3.9V
1N5992B
motorola
500 milliwatts glass silicon zener diode, zener voltage 4.7V
1N5993B
motorola
"500 milliwatts glass silicon zener diode, zener voltage 5.1V"
1N5994B
motorola
500 milliwatts glass silicon zener diode, zener voltage 5.6V
1N5995B
motorola
500 milliwatts glass silicon zener diode, zener voltage 6.2V
2009年4月11日星期六
1N4716,1N4717,1N4728A,1N4729A,1N4730A,1N4731A,1N4733A,1N4734A,1N4735A,1N4736A,1N4737A,1N4738A,1N4739A,1N4740A,1N4741A
1N4716
motorola
500 milliwatts glass silicon zener diode, zener voltage 39V
1N4717
motorola
500 milliwatts glass silicon zener diode, zener voltage 43V
1N4728A
motorola
Zener diode, 500 mW, zener voltage 3.3V
1N4729A
motorola
Zener diode, 500 mW, zener voltage 3.6V
1N4730A
motorola
Zener diode, 500 mW, zener voltage 3.9V
1N4731A
motorola
Zener diode, 500 mW, zener voltage 4.3V
1N4733A
motorola
Zener diode, 500 mW, zener voltage 5.1V
1N4734A
motorola
Zener diode, 500 mW, zener voltage 5.6V
1N4735A
motorola
Zener diode, 500 mW, zener voltage 6.2V
1N4736A
motorola
Zener diode, 500 mW, zener voltage 6.8V
1N4737A
motorola
Zener diode, 500 mW, zener voltage 7.5V
1N4738A
motorola
Zener diode, 500 mW, zener voltage 8.2V
1N4739A
motorola
Zener diode, 500 mW, zener voltage 9.1V
1N4740A
motorola
"Zener diode, 500 mW, zener voltage 10V"
1N4741A
motorola
Zener diode, 500 mW, zener voltage 11V
1N4742A
motorola
Zener diode, 500 mW, zener voltage 12V
1N4743A
motorola
Zener diode, 500 mW, zener voltage 13V
1N4744A
motorola
Zener diode, 500 mW, zener voltage 15V
1N4745A
motorola
Zener diode, 500 mW, zener voltage 16V
1N4746A
motorola
Zener diode, 500 mW, zener voltage 18V
1N4746A
motorola
Zener diode, 500 mW, zener voltage 18V
1N4747A
motorola
Zener diode, 500 mW, zener voltage 20V
1N4748A
motorola
Zener diode, 500 mW, zener voltage 22V
1N4749A
motorola
Zener diode, 500 mW, zener voltage 24V
1N4750A
motorola
Zener diode, 500 mW, zener voltage 27V
1N4750A
motorola
Zener diode, 500 mW, zener voltage 27V
1N4751A
motorola
Zener diode, 500 mW, zener voltage 30V
1N4753A
motorola
Zener diode, 500 mW, zener voltage 36V
1N4753A
motorola
"Zener diode, 500 mW, zener voltage 36V"
1N4754A
motorola
Zener diode, 500 mW, zener voltage 39V
motorola
500 milliwatts glass silicon zener diode, zener voltage 39V
1N4717
motorola
500 milliwatts glass silicon zener diode, zener voltage 43V
1N4728A
motorola
Zener diode, 500 mW, zener voltage 3.3V
1N4729A
motorola
Zener diode, 500 mW, zener voltage 3.6V
1N4730A
motorola
Zener diode, 500 mW, zener voltage 3.9V
1N4731A
motorola
Zener diode, 500 mW, zener voltage 4.3V
1N4733A
motorola
Zener diode, 500 mW, zener voltage 5.1V
1N4734A
motorola
Zener diode, 500 mW, zener voltage 5.6V
1N4735A
motorola
Zener diode, 500 mW, zener voltage 6.2V
1N4736A
motorola
Zener diode, 500 mW, zener voltage 6.8V
1N4737A
motorola
Zener diode, 500 mW, zener voltage 7.5V
1N4738A
motorola
Zener diode, 500 mW, zener voltage 8.2V
1N4739A
motorola
Zener diode, 500 mW, zener voltage 9.1V
1N4740A
motorola
"Zener diode, 500 mW, zener voltage 10V"
1N4741A
motorola
Zener diode, 500 mW, zener voltage 11V
1N4742A
motorola
Zener diode, 500 mW, zener voltage 12V
1N4743A
motorola
Zener diode, 500 mW, zener voltage 13V
1N4744A
motorola
Zener diode, 500 mW, zener voltage 15V
1N4745A
motorola
Zener diode, 500 mW, zener voltage 16V
1N4746A
motorola
Zener diode, 500 mW, zener voltage 18V
1N4746A
motorola
Zener diode, 500 mW, zener voltage 18V
1N4747A
motorola
Zener diode, 500 mW, zener voltage 20V
1N4748A
motorola
Zener diode, 500 mW, zener voltage 22V
1N4749A
motorola
Zener diode, 500 mW, zener voltage 24V
1N4750A
motorola
Zener diode, 500 mW, zener voltage 27V
1N4750A
motorola
Zener diode, 500 mW, zener voltage 27V
1N4751A
motorola
Zener diode, 500 mW, zener voltage 30V
1N4753A
motorola
Zener diode, 500 mW, zener voltage 36V
1N4753A
motorola
"Zener diode, 500 mW, zener voltage 36V"
1N4754A
motorola
Zener diode, 500 mW, zener voltage 39V
2009年4月10日星期五
DTV32D,DTV32F,DTV32G-1500B,DTV56D,DTV64D,DTV64F
DTV32D
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV32F
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV32G-1500B
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV56D
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV64D
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV64F
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV82D
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV82F
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
EF6805U3
ST Microelectronics
8-BIT MICROCOMPUTER UNIT
EF6840P
ST Microelectronics
Frequency clock 1 MHz Programmable Timer ? 1MHz
EF68B40P
ST Microelectronics
Frequency clock 2 MHz Programmable Timer ? 2MHz
EF68B40P
ST Microelectronics
Frequency clock 2 MHz Programmable Timer ? 2MHz
EF9345
ST Microelectronics
HMOS2 SINGLE CHIP SEMI-GRAPHIC DISPLAY PROCESSOR
EFS21-TL5
ST Microelectronics
STARLIGHT-KIT 2-CHIPS SET FOR FLUORESCENT LAMP STARTER - ASD
EFS21-TL5
ST Microelectronics
STARLIGHT-KIT 2-CHIPS SET FOR FLUORESCENT LAMP STARTER - ASD
EFS2B
ST Microelectronics
STARLIGHT-KIT 2-CHIPS SET FOR FLUORESCENT LAMP STARTER - ASD
EMIF01-10005W5
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION (ASD)
EMIF01-10018W5
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
EMIF01-5250SC5
ST Microelectronics
EMI FILTER WITH ESD PROTECTION - (ASD)
EMIF02-600FU7
ST Microelectronics
10-BIT WIDE EMI FILTER INCLUDING ESD PROTECTION
EMIF02-MIC02F1
ST Microelectronics
2 LINES EMI FILTER AND ESD PROTECTION
EMIF02-USB01
ST Microelectronics
2 LINES EMI FILTER INCLUDING ESD PROTECTION
EMIF03-SIM01
ST Microelectronics
3 LINES EMI FILTER INCLUDING ESD PROTECTION
EMIF04-10006F1
ST Microelectronics
4 LINES EMI FILTER AND ESD PROTECTION
EMIF04-2005QCF
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
EMIF04-MMC02F1
ST Microelectronics
4 LINES EMI FILTER INCLUDING ESD PROTECTION
EMIF06-10006F1
ST Microelectronics
6 LINES EMI FILTER AND ESD PROTECTION
EMIF08-2005QEJ
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
EMIF09-02726S3
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
EMIF09-02726S6
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV32F
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV32G-1500B
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV56D
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV64D
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV64F
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV82D
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
DTV82F
ST Microelectronics
HIGH VOLTAGE DAMPER DIODE (CRT HORIZONTAL DEFLECTION)
EF6805U3
ST Microelectronics
8-BIT MICROCOMPUTER UNIT
EF6840P
ST Microelectronics
Frequency clock 1 MHz Programmable Timer ? 1MHz
EF68B40P
ST Microelectronics
Frequency clock 2 MHz Programmable Timer ? 2MHz
EF68B40P
ST Microelectronics
Frequency clock 2 MHz Programmable Timer ? 2MHz
EF9345
ST Microelectronics
HMOS2 SINGLE CHIP SEMI-GRAPHIC DISPLAY PROCESSOR
EFS21-TL5
ST Microelectronics
STARLIGHT-KIT 2-CHIPS SET FOR FLUORESCENT LAMP STARTER - ASD
EFS21-TL5
ST Microelectronics
STARLIGHT-KIT 2-CHIPS SET FOR FLUORESCENT LAMP STARTER - ASD
EFS2B
ST Microelectronics
STARLIGHT-KIT 2-CHIPS SET FOR FLUORESCENT LAMP STARTER - ASD
EMIF01-10005W5
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION (ASD)
EMIF01-10018W5
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
EMIF01-5250SC5
ST Microelectronics
EMI FILTER WITH ESD PROTECTION - (ASD)
EMIF02-600FU7
ST Microelectronics
10-BIT WIDE EMI FILTER INCLUDING ESD PROTECTION
EMIF02-MIC02F1
ST Microelectronics
2 LINES EMI FILTER AND ESD PROTECTION
EMIF02-USB01
ST Microelectronics
2 LINES EMI FILTER INCLUDING ESD PROTECTION
EMIF03-SIM01
ST Microelectronics
3 LINES EMI FILTER INCLUDING ESD PROTECTION
EMIF04-10006F1
ST Microelectronics
4 LINES EMI FILTER AND ESD PROTECTION
EMIF04-2005QCF
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
EMIF04-MMC02F1
ST Microelectronics
4 LINES EMI FILTER INCLUDING ESD PROTECTION
EMIF06-10006F1
ST Microelectronics
6 LINES EMI FILTER AND ESD PROTECTION
EMIF08-2005QEJ
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
EMIF09-02726S3
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
EMIF09-02726S6
ST Microelectronics
EMI FILTER INCLUDING ESD PROTECTION
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